Ideal Microstrip Impedance Calculator
Uses the Hammerstad–Jensen single-ended microstrip model documented in Qucs: zero trace thickness, uniform dielectric above an ideal ground plane and air above the trace. This implementation is restricted to 0.1≤w/h≤10 and 1≤εr≤20. It computes Z0 and effective permittivity, using free-space impedance ≈376.73 Ω. No copper-thickness correction, solder mask, roughness, loss, dispersion, differential pair, stripline, fabrication tolerance or material lookup. No real-PCB, signal-integrity, safety or manufacturing-qualification guarantee. All three inputs are user supplied; local computation only.
A QUICK WALKTHROUGH
How to use this tool
- Enter width, dielectric height and relative permittivity.
- Calculate ideal model
- Zero-thickness quasi-static model result only.
Ideal Microstrip Impedance Calculator
Uses the Hammerstad–Jensen single-ended microstrip model documented in Qucs: zero trace thickness, uniform dielectric above an ideal ground plane and air above the trace. This implementation is restricted to 0.1≤w/h≤10 and 1≤εr≤20. It computes Z0 and effective permittivity, using free-space impedance ≈376.73 Ω. No copper-thickness correction, solder mask, roughness, loss, dispersion, differential pair, stripline, fabrication tolerance or material lookup. No real-PCB, signal-integrity, safety or manufacturing-qualification guarantee. All three inputs are user supplied; local computation only.
Hammerstad–Jensen
Results use three significant digits; this is not a precision or accuracy guarantee. Formula reference: Qucs, Single microstrip line, equations 11.4, 11.6 and 11.15–18.
GOOD TO KNOW
Common questions
What does the model assume?
It assumes zero trace thickness, a uniform dielectric over an ideal ground plane, air above the trace, and a single-ended microstrip within the stated w/h and εr limits.
Can I use this as a PCB design guarantee?
No. It omits copper thickness, solder mask, losses, tolerances, material lookup, and other real-board effects; verify with appropriate engineering methods.